GM5BW97333A【PDF 14/15 页】LED WHITE 11500K 20MA 3.2V PLCC4

Sheet No.: DG-089015B

Preliminary

GM5BW9733xA (Series)

?SPAN class="pst GM5BW97333A_2656847_3">Recommended Solder Pad Design

1. Solderability depends on reflow conditions, solder paste, and circuit board materials. Check the entire process

before production commences.

2. Fig. 19 shows the recommended solder pad design for this part.

3. When using backside dip methods, Sharp recommends checking the process carefully: board warping from heat

can cause mechanical failure in these parts, in addition to the high heat conducted into the part through the

leads. Performing reflow after dip is recommended, with the interval between the two as short as possible.

?SPAN class="pst GM5BW97333A_2656847_3">Pick and Place Recommendations

1. Picking errors can occur based on the machines setup, so Sharp recommends verification with the machine in

actual use.

2. Do not allow the pick and place machine to contact the sealing resin in this part. If mechanical stress is placed

on the sealing resin, such forces can cause the resin to fail, or cause bonding wires within the part to break.

?SPAN class="pst GM5BW97333A_2656847_3">Presence of ODCs

This product shall not contain the following materials, and they are not used in the production process for this

product:

"Regulated substances: CFCs, Halon, Carbon tetrachloride, and 1,1,1-Trichloroethane (Methylchloroform).

Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.

This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).

"Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl

ethers (PBDE).

Fig. 19 Recommended Solder Pad Design

1.5

OTE: Unit: mm

1.5

4.5

Center of Product

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